| PART |
Description |
Maker |
| HF9616 HF9616-006L-22-1 HF9616-006L-22-2 HF9616-00 |
1 CUBIC INCH 3 FORM C HERMETICALLY SEALED LATCHING RELAY
|
Hongfa Technology
|
| CR2025 |
3.0 Volts 2.8 grams (0.10 oz.) 0.8 cubic centimeters (0.05 cubic inch)
|
ENERGIZER[Energizer]
|
| EL123 |
3.0 Volts 16.8 grams (0.59 oz.) 7.1 cubic centimeters (0.4 cubic inch)
|
ENERGIZER[Energizer]
|
| CR1616 |
3.0 Volts 1.2 grams (0.04 oz.) 0.32 cubic centimeters (0.02 cubic inch)
|
ENERGIZER[Energizer]
|
| CR2012 |
3.0 Volts 1.3 grams (0.04 oz.) 0.3 cubic centimeters (0.02 cubic inch)
|
Energizer
|
| L91 |
1.5 Volts 14.5 grams (0.5 oz.) 8.0 cubic centimeters (0.5 cubic inch)
|
Energizer Battery Company
ENERGIZER[Energizer]
|
| WE128K32-XH1X WE128K32-XG2TX WE128K32NP-200H1Q WE1 |
EEPROM MCP
128K X 32 EEPROM 5V MODULE, 200 ns, CPGA66 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66
128K X 32 EEPROM 5V MODULE, 120 ns, CPGA66 1.075 x 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66
128K X 32 EEPROM 5V MODULE, 150 ns, CPGA66 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66
128K X 32 EEPROM 5V MODULE, 140 ns, CPGA66 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66
128K X 32 EEPROM 5V MODULE, 250 ns, CPGA66 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66
|
Microsemi, Corp.
White Electronic Designs, Corp.
|
| MBC550-1T15 MBC550-1T12 MBC550-1T30 MBC550-1T24 MB |
5 x 3 x 1.5 Inch Form Factor
|
Bel Fuse Inc.
|
| DAC08Q2/38510 DAC08Q5/38510 |
PARALLEL, 8 BITS INPUT LOADING, 8-BIT DAC, CDIP16 0.250 X 0.875 INCH, HERMETIC SEALED, CERAMIC, DIP-16
|
Analog Devices, Inc.
|
| FTR-F2AK005T FTR-F2AK024T FTR-H2AK024T FTR-B2NA4.5 |
4 Pole (2 FORM C 2 FORM A) Signal Relay for Central Switching/ Data Transmission
|
Fujitsu Component Limited.
|
| AD4C113 |
1 Form A/1 Form B Solid State Relay
|
SSOUSA[Solid State Optronic]
|
